Canteliver Probe Card
MPI Cantilever Probe Card is commonly used on gold bump and pad wafer testing for Display screen driver, logic, and memory gadget. MPI’s cantilever probes are definitely the corresponding reply to your requires of fiÂne pitch, small pad dimension, substantial pace, less cleaning, multi-DUT, higher pin count, and ultra-reduced leakage demands. With remarkable craftsmanship, revolutionary architecture and verified methodologies determined by mechanical and electrical simulation/measurement effects, building MPI the best cantilever service provider worldwide.
FCB Probe Card
The FCB Probe Card is the most experienced technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) desire. FCB can be a verified Remedy for various semiconductor creation tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for product necessitating higher sign integrity probing (SI) and/or electric power integrity probing (PI). Apps include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB guarantees the earth’s finest Over-all Price-of-possession (COO) for various DUT apps.
EVS Probe Card
The EVS Probe Card is surely an enhancement around the standard buckling beam probe card. Vital capabilities are greater present-day carrying ability (C.C.C.) and reduced balanced Call drive (BCF), and also overall MEMS-like features. EVS can easily satisfy the need of Superior wafer probing. Specific alignment and superb planarity Regulate would be the critical factors contributing to steady Call resistance. With its capacity and functionality, EVS Probe Card is an ideal choice for Innovative probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s solution to need for ever finer pitch. It can be designed for smaller sized Al pad, and is also perfect for very small pitch software with peripheral and full array pattern. With precise alignment and greater planarity Regulate, Osprey can arrive at greater productivity by multi-DUT design and style. The forming wire (FW) form needle manufactured with MPI’s own micro fabrication procedure not click here just delivers large-good quality effectiveness but will also will allow easy needle replacement and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which is suitable for the demand from customers of small drive probing. In addition it comes along with the opportunity to satisfy higher C.C.C. and higher pin counts application. The MEMS system makes sure remarkably regular needle attributes, as well as the Unique structure structure allows precise alignment and planarity Regulate.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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